Download ESH1C Datasheet PDF
Taiwan Semiconductor
ESH1C
FEATURES - Glass passivated chip junction - Ideal for automated placement - Low profile package - Ultra Fast recovery time for high efficiency - Moisture sensitivity level: level 1, per J-STD-020 - Ro HS pliant - Halogen-free according to IEC 61249-2-21 APPLICATIONS - DC to DC converter - Switching mode converters and inverters - Lighting application - Snubber - Freewheeling application KEY PARAMETERS PARAMETER VALUE UNIT IF VRRM - 200 V IFSM TJ MAX Package °C DO-214AC (SMA) Configuration Single die MECHANICAL DATA - Case: DO-214AC (SMA) - Molding pound meets UL 94V-0 flammability rating - Terminal: Matte tin plated leads, solderable per J-STD-002 - Meet JESD 201 class 2 whisker test - Polarity: Indicated by cathode band - Weight: 0.060g (approximately) DO-214AC (SMA) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL ESH1B ESH1C ESH1D Marking code on the device ESH1B ESH1C ESH1D Repetitive peak reverse...