Absolute Maximum Ratings (Ta = 25°C)
TLP261J
Characteristic
Symbol
Rating
Unit
Forward current
Forward current derating (Ta ≥ 53°C)
Peak forward current (100 μs pulse, 100 pps)
Reverse voltage
Diode power dissipation
Diode power dissipation derating (Ta ≥ 53°C)
Junction temperature
Off-state output terminal voltage
On-state RMS current
Ta = 25°C
Ta = 70°C
IF
ΔIF / °C
IFP
VR
PD
ΔPD /°C
Tj
VDRM
IT(RMS)
50
mA
-0.7
mA / °C
1
A
5
V
100
mW
-1.4
mW/°C
125
°C
600
V
70
mA
40
On-state current derating (Ta ≥ 25°C)
Peak on-state current (100 μs pulse, 120 pps)
Peak nonrepetitive surge current (PW = 10 ms)
Output power dissipation
Output power dissipation derating (Ta ≥ 25°C)
Junction temperature
Storage temperature range
Operating temperature range
Lead soldering temperature (10 s)
Isolation voltage (AC, 60 s, R.H ≤ 60 %)
(Note 1)
ΔIT / °C
ITP
ITSM
PO
ΔPO / °C
Tj
Tstg
Topr
Tsol
BVS
-0.67
2
1.2
200
-2.0
100
-55 to 125
-40 to 100
260
3000
mA / °C
A
A
mW
mW / °C
°C
°C
°C
°C
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered as a two-terminal device: Pins 1 and 3 shorted together and pins 4 and 6 shorted
together.
Recommended Operating Conditions
Characteristic
Symbol
Min Typ. Max Unit
Supply voltage
VAC
―
―
240 Vac
Forward current
Peak on-state current
IF
15
20
25
mA
ITP
―
―
1
A
Operating temperature
Topr
-25
―
85
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
devices. Each item also has its own independent guideline document. In developing designs using these
products, please confirm the specified characteristics shown in these documents.
© 2019
2
Toshiba Electronic Devices & Storage Corporation
2019-06-17
