Absolute Maximum Ratings (Ta = 25°C)
Forward Current (Ta ≤ 83°C)
Forward Current Derating (Ta ≥ 83°C)
Peak Transient Forward Current
Diode power dissipation
Diode power dissipation derating (Ta ≥ 83°C)
Output Current 1 (Ta ≤ 25°C)
25 / -15
Output Current 2 (Ta ≤ 100°C)
13 / -13
-0.5 to 20
-0.5 to 20
Power dissipation derating (Ta ≥ 25°C)
ΔPC / °C
mW / °C
Operating Temperature Range
-40 to 100
Storage Temperature Range
-55 to 125
Lead Solder Temperature (10 s)
Isolation Voltage (AC,60 s, R.H. ≤ 60 %)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width PW ≤ 1 μs, 300 pps.
Note 2: Device Considered a two terminal device: pins 1, 2 and 3 shorted together and pins 4, 5 and 6 shorted together.
Recommended Operating Conditions
SYMBOL MIN TYP. MAX UNIT
Input Current, ON
Input Voltage, OFF
Note 1: This item denotes operating ranges, not meaning of recommended operating conditions.
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this product,
please confirm specified characteristics shown in this document.
Toshiba Electronic Devices & Storage Corporation