Absolute Maximum Ratings (Ta = 25°C)
SYMBOL RATING UNIT
Forward Current (Ta ≤ 83°C)
Forward Current Derating (Ta ≥ 83°C)
Peak Transient Forward Current
Input power dissipation
Input power dissipation derating (Ta ≥ 83°C)
(Note 1) IFPT
Output Current 1 (Ta ≤ 25°C)
Output Current 2 (Ta ≤ 100°C)
Output power dissipation
Output power dissipation derating （Ta ≥ 25°C）
25 / −15
13 / −13
VO −0.5 to 20
VCC −0.5 to 20
mW / °C
Operating Temperature Range
Topr −40 to 100
Storage Temperature Range
Tstg −55 to 125
Lead Solder Temperature (10 s)
Isolation Voltage (AC, 60 s, R.H. ≤ 60 %)
(Note 2) BVS
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width PW ≤ 1 μs, 300 pps.
Note 2: Device Considered a two terminal device: pins 1, 2 and 3 shorted together and pins 4, 5 and 6 shorted together.
Recommended Operating Conditions
SYMBOL MIN TYP. MAX UNIT
Input Current, ON
Input Voltage, OFF
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this product,
please confirm specified characteristics shown in this document.
Note 1: This item denotes operating ranges, not meaning of recommended operating conditions.
Toshiba Electronic Devices & Storage Corporation