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Toshiba Electronic Components Datasheet

TLP797J Datasheet

Photocoupler Photorelay

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TOSHIBA Photocoupler Photo Relay
TLP797J
Telecommunication
Measurement Instrumenation
FA
TLP797J
Unit: mm
The TOSHIBA TLP797J consists of an infrared emitting diode optically
coupled to a photo-MOS FET in a six lead plastic DIP package (DIP6).
The TLP797J is a bi-directional switch can replace mechanical relays in
many applications.
6 pin DIP (DIP6)
1-form-A
Peak off-state voltage: 600 V (min)
Trigger LED current: 5 mA (max)
On-state current: 100 mA (max)
On-state resistance: 35 Ω (max)
Isolation voltage: 5000 Vrms (min)
UL-recognized: UL 1577, File No.E67349
cUL-recognized: CSA Component Acceptance Service No.5A
File No.E67349
VDE- approved: EN 60747-5-5 (Note 1)
JEDEC
JEITA
TOSHIBA
11-7A8S
Weight: 0.4 g (typ.)
Note 1 : When a VDE approved type is needed, please designate the Option(D4).
Construction mechanical rating
7.62 mm pitch
standard type
10.16 mm pitch
TLPXXXF type
Creepage distance
Clearance
Insulation thickness
7.0 mm (min)
7.0 mm (min)
0.4 mm (min)
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
Note: When applying safety standard certification,
use the standard part number, e.g., TLP797J.
Schematic
Pin Configurations (top view)
1
6
1: Anode
2: Cathode
3: N.C.
2
5
4: Drain D1
5: Source
3
4
6: Drain D2
© 2019
1
Toshiba Electronic Devices & Storage Corporation
Start of commercial production
2001-07
2019-06-24


Toshiba Electronic Components Datasheet

TLP797J Datasheet

Photocoupler Photorelay

No Preview Available !

Absolute Maximum Ratings (Ta = 25°C)
TLP797J
Characteristics
Symbol
Rating
Unit
Forward current
Forward current derating (Ta 25°C)
Peak forward current (100 μs pulse, 100 pps)
LED
Reverse voltage
Diode power dissipation
Diode power dissipation derating (Ta 25°C)
Junction temperature
Off-state output terminal voltage
A connection
On-state current B connection
C connection
Detector
On-state current
derating
(Ta 25°C)
Output power
dissipation
A connection
B connection
C connection
A connection
B connection
C connection
Output power
dissipation derating
(Ta 25°C)
A connection
B connection
C connection
Junction temperature
Storage temperature range
Operating temperature range
Lead soldering temperature (10 s)
Isolation voltage (AC, 60 s, R.H. 60 %) (Note 1)
IF
IF/°C
IFP
VR
PD
PD /°C
Tj
VOFF
ION
ION/°C
PO
ΔPO /°C
Tj
Tstg
Topr
Tsol
BVS
50
0.5
1
5
50
-0.5
125
600
100
100
200
1.0
1.0
2.0
430
330
504
-4.3
-3.3
-5.04
125
55 to 125
40 to 85
260
5000
mA
mA/°C
A
V
mW
mW/°C
°C
V
mA
mA/°C
mW
mW / °C
°C
°C
°C
°C
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two-terminal device: Pins 1, 2 and 3 shorted together, and pins 4, 5 and 6 shorted
together.
Recommended Operating Conditions
Characteristics
Symbol
Min Typ. Max Unit
Supply voltage
Forward current
On-state current
Operating temperature
VDD
480
V
IF
7.5
15
25
mA
ION
100 mA
Topr
20
65
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
© 2019
2
Toshiba Electronic Devices & Storage Corporation
2019-06-24


Part Number TLP797J
Description Photocoupler Photorelay
Maker Toshiba
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TLP797J Datasheet PDF






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