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UNION OPTRONICS

SLD-1310-P5-C-05 Datasheet Preview

SLD-1310-P5-C-05 Datasheet

1310nm Laser Diode Chips

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1310nm Laser Diode Chips
1310nm Laser Diode Chips
SLD-1310-P5-C-05
SLD-1310-P5-C-05
UNION OPTRONICS CORP.
Specifications
(1) Size :
(2) Device:
(3) Structure:
300*300*100μm
Laser diode bare chip
Double channel , single ridge waveguide
External dimensions(Unit :μm)
Waveguide
P_electrode
N_electrode
300μm
Bonding pad locate on the right side to the emitting direction.
Maxmum Ratings (Tc = 250C)
Characteristic
Optical Output Power
LD Reverse Voltage
Operation Temperature
Storage Temperature
Symbol
Po
Vr (LD)
Top
Tstg
Rating
7
2
-40 ~ +85
-40 ~ +125
Unit
mW
V
oC
oC
友嘉科技股份有限公司
桃園縣楊梅鎮3鄰高獅路156
UNION OPTRONICS CORP.
No, 156 Kao-Shy Road Yang-Mei, Tao-Yuan, Taiwan, R.O.C.
TEL : 886-3-485-2687
FAX : 886-3-475-4378
E-mail : sales@uocnet.com
Revise: 2006/03/01




UNION OPTRONICS

SLD-1310-P5-C-05 Datasheet Preview

SLD-1310-P5-C-05 Datasheet

1310nm Laser Diode Chips

No Preview Available !

1310nm Laser Diode Chips
SLD-1310-P5-C-05
UNION OPTRONICS CORP.
Optical-electrical characteristics (Tc = 250C)
Characteristic
Symbol Test Condition
Threshhold Current
Ith Tc = 250C
Operating Current
Iop Tc =-40 ~ +85oC
Operation Voltage
Vop Po = 5mW
Slope Efficiency
SE Po = 1 to 4mW
Lasing Wavelength
λ Po = 5mW
Spectral Width
∆λ Po = 5mW
Optical Output Power
Po CW, Kink free
P-I Kink
Ki Po < 5mW
Beam Divergence Parallel θ// Po = 5mW
(FWHM)
Perpendicula θ⊥
Po = 5mW
Min.
-
-
-
0.25
1290
-
5
-
-
-
Typ.
10
22
1.3
0.35
1310
3
-
-
18
38
Max. Unit
15 mA
35 mA
1.5 V
- mW/mA
1330 nm
5 nm
- mW
20 %
- deg.
- deg.
Precautions
QUALITY ASSURANCE
After any processing of laser chip or laser diode TO-CAN (LD) by the customer, the
performance, yield and reliability of the product, in which the chip or LD is applied, are subject
to change due to customer’s handling, assembly, testing, and processing. Because laser chip and
LD are strongly affected by environmental conditions, physical stress, and chemical stresses
imposed by customer that are not in Union Optronics Corp. (UOC) control and hence no
guarantee on the characteristics and the reliability at all after the shipment. Also, UOC does not
have any responsibility for field failures in a customer product. When attaching a heat sink to
laser chip or LD, be careful not to apply excessive force to the device in the process.
SAFETY PRECAUTIONS
Although Union Optronics Corp. (UOC) keeps improving quality and reliability of its laser chip
and laser diode TO-CAN (LD), semiconductor devices in general can malfunction or fail due to
their intrinsic characteristics. Hence, it is required that the customer’s products are designed
with full regard to safety by incorporating the redundancy, fire prevention, error prevention so
that any problems or error with UOC laser chip or LD does not cause any accidents resulting in
injury, death, fire, property damage, economic damage, or environmental damage. In case
customer wants to use UOC laser chip or LD in the systems requiring high safety, customer is
requested to confirm safety of entire systems with customer’s own testing.
SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
The information provided by Union Optronics Corp. (UOC), including but not limited to
technical specifications, recommendations, and application notes relating to laser chip or laser
diode TO-CAN (LD) is believed to be reliable and accurate and is subject to change without
notice. UOC reserves the right to change its assembly, test, design, form, specification, control,
or function without notice.
UNION OPTRONICS CORP.


Part Number SLD-1310-P5-C-05
Description 1310nm Laser Diode Chips
Maker UNION OPTRONICS
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