UCC2912
UCC3912
PROGRAMMABLE HOT SWAP POWER MANAGER
SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003
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description (continued)
The UCC3912 family is designed for unidirectional current flow, emulating an ideal diode in series with the power
switch. This feature is particularly attractive in applications where many devices are powering a common bus,
such as with SCSI Termpwr.
The UCC3912 family can be put into sleep mode drawing only 1-µA of supply current. The SHTDWN pin has
a preset threshold hysteresis which allows the user the ability to set a time delay upon startup to achieve
sequencing of power. Other features include an open drain FAULT output indicator, thermal shutdown, under
voltage lockout, and a low thermal resistance small outline package.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†}
VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V
FAULT sink current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
FAULT voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to VIN
Output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self Limiting
Input voltage
(B0, B1, B2, B3, IMAX, SHTDWN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to VIN
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to 150°C
Operating junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to 150°C
Lead temperature (soldering, 10 sec.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Interface Products Data book (TI Literature
Number SLUD002) for thermal limitations and considerations of packages.
package information
DIL-16, SOIC-16
N, DP Package
(TOP VIEW)
TSSOP-24,
PWP Package
(TOP VIEW)
SHTDWN1
N/C 2
VIN 3
VIN 4
GND* 5
GND* 6
GND* 7
GND* 8
EGND* 9
B3 10
B2 11
B1 12
24 FAULT
23 N/C
22 VOUT
21 VOUT
20 GND*
19 GND*
18 GND*
17 GND*
16 GND*
15 CT
14 IMAX
13 B0
*Pin 5 serves as lowest impedance to the electrical
ground; Pins 4, 12, and 13 serve as heat sink/ground.
These pins should be connected to large etch areas to
help dissipate heat. For N package, pins 4, 12, and 13
are N/C.
*Pin 9 serves as lowest impedance to the electrical ground;
other GND pins serve as heat sink/ground. These pins should
be connected to large etch areas to help dissipate heat.
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