No crosstalk between inductors due to magnetic shield Perfect for high density installation.
Unified automatic chip mounting shape with no directionality.
Excellent solderability and high resistance for either flow or reflow soldering.
Monolithic structure for high reliability
Dimensions
SERIES L W T
Unit: mm (inch) a
W L T
0.8 ± 0.15 MLF 1608 1.6 ± 0.15 0.8 ± 0.15 (0.032 ± .006) 0.3 ± 0.2 (0603) (0.064 ± .006) (0.032 ± .006) 1.2 ±.
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Multilayer Chip Inductors
Features
• No crosstalk between inductors due to magnetic shield Perfect for high density installation • Unified automatic chip mounting shape with no directionality • Excellent solderability and high resistance for either flow or reflow soldering • Monolithic structure for high reliability
Dimensions
SERIES L W T
Unit: mm (inch) a
W L T
0.8 ± 0.15 MLF 1608 1.6 ± 0.15 0.8 ± 0.15 (0.032 ± .006) 0.3 ± 0.2 (0603) (0.064 ± .006) (0.032 ± .006) 1.2 ± 0.2 (0.012 ± .008) (0.048 ± .008) 0.85 ± 0.2 MLF 2012 2.0 ± 0.2 1.25 ± 0.2 (0.034 ± .008) 0.5 ± 0.3 (0805) (0.080 ± .008) (0.050 ± .008) 1.25 ± 0.2 (0.020 ± .012) (0.050 ± .008) 0.6 ± 0.2 MLF 3216 3.2 ± 0.2 1.6 ± 0.2 (0.024 ± .008) 0.