BYG21K Overview
Package 20 mJ 150 °C SMA (DO-214AC) Circuit configuration Single.
BYG21K Key Features
- Low profile package
- Ideal for automated placement
- Glass passivated pellet chip junction
- Low reverse current
- Soft recovery characteristic
- Fast reverse recovery time
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- AEC-Q101 qualified available
- Automotive ordering code P/NHE3 or P/NHM3
- Material categorization: for definitions of pliance please see .vishay./doc?99912
