FGP30C Key Features
- Superectifier structure for high reliability condition
- Cavity-free glass-passivated junction
- Ideal for automated placement
- Ultrafast reverse recovery time
- Low switching losses, high efficiency
- High forward surge capability
- Meets environmental standard MIL-S-19500
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- AEC-Q101 qualified
