IHPT1411AFELR73AB0
Description
IHPT-1411AF MODEL R73 FORCE COEFFICIENT TRAY PACKAGE CODE e3 JEDEC® LEAD (Pb)-FREE STANDARD MATERIAL Core Wire Solder Laminated steel Copper, PU/PA insulated Hot dip tin DIMENSIONS in inches [millimeters] IHPT1207AGELR39AB0 (25N) SOLDER POSITION Sn Cu 99.3 % 0.7 % 0.167 ± 0.005 [4.25 ± 0.13] 0.68 ± 0.01 [17.28 ± 0.25] 1.222 max.
Key Features
- High impulse vibrations for clear tactile feedback in noisy environments
- Drives 0.5 kg load to 6 g’s of acceleration with 12 V, 5 ms pulse (tested with Vishay’s custom spring return fixture)
- Standard lead termination is dipped 100 % tin solder; customer specific connectors available upon request
- Two-piece magnetic solenoid construction with mounting holes; prised of stationary “U” core and moving “I-bar”
- Material categorization: for definitions of pliance please see .vishay./doc?99912 LINKS TO ADDITIONAL RESOURCES Product Page 3D 3D 3D Models
