Description
IHPT-1411AF MODEL
R73 FORCE COEFFICIENT
TRAY PACKAGE CODE
e3 JEDEC® LEAD (Pb)-FREE STANDARD
MATERIAL
Core Wire Solder
Laminated steel Copper, PU/PA insulated
Hot dip tin
DIMENSIONS in inches [millimeters]
IHPT1207AGELR39AB0 (25N)
SOLDER COMPOSITION
Sn Cu
99.3 % 0.7 %
0.167 ± 0.005 [4.25 ± 0.13]
0.68 ± 0.01 [17.28 ± 0.25]
1.222 max.[31.05 max.] 0.080 ± 0.010 [2.03 ± 0.25]
[ØØ02..02859±±0.0.103]05
5.12 ± 0.39 [130 ± 10] typ.flying lead
DYNAMIC
0.128 ± 0.010 [3.25 ± 0.25]
0.443 ± 0.0
Features
- High impulse vibrations for clear tactile feedback in noisy environments.
- Drives 0.5 kg load to 6 g’s of acceleration with 12 V, 5 ms pulse (tested with Vishay’s custom spring return fixture).
- Standard lead termination is dipped 100 % tin solder; customer specific connectors available upon request.
- Two-piece magnetic solenoid construction with mounting holes; comprised of stationary “U” core and moving “I-bar”.
- Material categorization: for definition.