SA7.5 Key Features
- Glass passivated chip junction
- Available in uni-directional and bi-directional
- 500 W peak pulse power capability with a
- Excellent clamping capability
- Very fast response time
- Low incremental surge resistance
- Solder dip 260 °C, 40 seconds
- ponent in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
