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VESD05C-FC1 - Flip Chip Protection Diode

Description

Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing.

The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for excellent clamping (protection) performance with low leakage current characteristic.

Features

  • ESD protection to IEC 61000-4-2 30 kV (air).
  • ESD protection to IEC 61000-4-2 8 kV (contact).
  • ESD protection to IEC 61000-4-5 (lightning): 8/20 µs, IPPM = 10 mA.
  • 120 W peak pulse power dissipation per line (8/20 µs).
  • Suitable for high frequency.

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Datasheet Details

Part number VESD05C-FC1
Manufacturer Vishay
File Size 194.80 KB
Description Flip Chip Protection Diode
Datasheet download datasheet VESD05C-FC1 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet.co.kr VISHAY VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for excellent clamping (protection) performance with low leakage current characteristic. 1 2 19120 Features • ESD protection to IEC 61000-4-2 30 kV (air) • ESD protection to IEC 61000-4-2 8 kV (contact) • ESD protection to IEC 61000-4-5 (lightning): 8/20 µs, IPPM = 10 mA • 120 W peak pulse power dissipation per line (8/20 µs) • Suitable for high frequency applications (low capacitance, low parasitic inductance) • Low clamping voltage • Minimum PCB space needed (0.
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