VESD12A1A-HD1
Key Features
- Ultra compact LLP1006-2L package
- Low package height < 0.4 mm
- 1-line ESD protection
- Low leakage current < 0.01 μA
- Low load capacitance CD = 22.5 pF (VR = 6 V; f = 1 MHz)
- ESD immunity acc. IEC 61000-4-2 ± 30 kV contact discharge ± 30 kV air discharge
- High surge current acc. IEC 61000-4-5 IPP > 8 A
- Soldering can be checked by standard vision inspection. No X-ray necessary
- Pin plating NiPdAu (e4) no whisker growth
- e4 - precious metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn)
