Datasheet Details
| Part number | VS-FCSP05H40TR |
|---|---|
| Manufacturer | Vishay |
| File Size | 112.56 KB |
| Description | Schottky diode |
| Datasheet |
 VS-FCSP05H40TR Datasheet
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| Part number | VS-FCSP05H40TR |
|---|---|
| Manufacturer | Vishay |
| File Size | 112.56 KB |
| Description | Schottky diode |
| Datasheet |
VS-FCSP05H40TR Datasheet
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Vishay’s FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry.
The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space.
The anode and cathode connections are made through solder bump pads on one side of the silicon enabling designers to strategically place the diodes on the PCB.
www.vishay.com VS-FCSP05H40TR Vishay Semiconductors FlipKY®, Chip Scale Package Schottky Barrier Rectifier, 0.
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