VS-FCSP0530ETR Overview
Description
FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space.
Key Features
- Ultralow VF to footprint area
- Very low profile (< 0.6 mm)
- Low - Supplied tested and on tape and reel
- Designed for consumer level
