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VS-FCSP0530ETR - Schottky diode

Description

FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry.

The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space.

Features

  • Ultralow VF to footprint area.
  • Very low profile (< 0.6 mm).
  • Low thermal resistance.
  • Supplied tested and on tape and reel.
  • Designed for consumer level.

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Datasheet preview – VS-FCSP0530ETR

Datasheet Details

Part number VS-FCSP0530ETR
Manufacturer Vishay
File Size 106.93 KB
Description Schottky diode
Datasheet download datasheet VS-FCSP0530ETR Datasheet
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Full PDF Text Transcription

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www.vishay.com FlipKY® PRODUCT SUMMARY IF(AV) VR VF at IF IRM max. at 25 °C IRM max. at 125 °C TJ max. EAS VS-FCSP0530ETR Vishay Semiconductors FlipKY®, 0.5 A FEATURES • Ultralow VF to footprint area • Very low profile (< 0.6 mm) • Low thermal resistance • Supplied tested and on tape and reel • Designed for consumer level APPLICATIONS • Reverse polarity protection • Current steering • Freewheeling • Flyback • Oring 0.5 A 30 V 0.33 V 50 μA 15 mA 150 °C 5 mJ DESCRIPTION FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space.
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