BA159GP
Key Features
- Superectifier structure for high reliability condition
- Cavity-free glass-passivated junction
- Fast switching for high efficiency
- Low leakage current, typical IR less than 0.1 μA
- High forward surge capability
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: for definitions of pliance
