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BA159GP - Fast Switching Plastic Rectifier

Download the BA159GP datasheet PDF. This datasheet also covers the BA158GP variant, as both devices belong to the same fast switching plastic rectifier family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Superectifier structure for high reliability condition.
  • Cavity-free glass-passivated junction.
  • Fast switching for high efficiency.
  • Low leakage current, typical IR less than 0.1 μA.
  • High forward surge capability.
  • Solder dip 275 °C max. 10 s, per JESD 22-B106.
  • Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (BA158GP_VishaySiliconix.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number BA159GP
Manufacturer Vishay
File Size 68.29 KB
Description Fast Switching Plastic Rectifier
Datasheet download datasheet BA159GP Datasheet

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Other Datasheets by Vishay

Part Number Description
BA159 Fast Switching Plastic Rectifier
BA159D (BA157 - BA159) Fast Switching Plastic Rectifier
BA159DGP Fast Switching Plastic Rectifier
BA157 Fast Switching Plastic Rectifier
BA157GP Fast Switching Plastic Rectifier

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.vishay.com BA157GP, BA158GP, BA159DGP, BA159GP Vishay General Semiconductor Glass Passivated Junction Fast Switching Plastic Rectifier SUPERECTIFIER® DO-204AL (DO-41) PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 400 V, 600 V, 800 V, 1000 V IFSM 20 A trr 150 ns, 250 ns, 500 ns IR 5.0 μA VF 1.3 V TJ max. Package 175 °C DO-204AL (DO-41) Diode variation Single die FEATURES • Superectifier structure for high reliability condition • Cavity-free glass-passivated junction • Fast switching for high efficiency • Low leakage current, typical IR less than 0.1 μA • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance please see www.vishay.