BU1006
Overview
- UL recognition file number E312394
- Thin single in-line package
- Glass passivated chip junction
- Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S) Available
- Superior thermal conductivity
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: for definitions of compliance please see
