Download the BU1508 datasheet PDF.
This datasheet also covers the BU1506 variant, as both devices belong to the same bridge rectifiers family and are provided as variant models within a single manufacturer datasheet.
Key Features
UL recognition file number E312394.
Thin single in-line package.
Glass passivated chip junction.
Available for BU-5S lead forming option (part number with “5S” suffix, e. g. BU15065S)
Available.
Superior thermal conductivity.
Solder dip 275 °C max. 10 s, per JESD 22-B106.
Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.
Full PDF Text Transcription for BU1508 (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
BU1508. For precise diagrams, and layout, please refer to the original PDF.
www.vishay.com BU1506, BU1508, BU1510 Vishay General Semiconductor Enhanced isoCink+™ Bridge Rectifiers + ~~ isoCink+™ Case Style BU - ~~+ +~~ - LINKS TO ADDITIONAL RESOU...
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ers + ~~ isoCink+™ Case Style BU - ~~+ +~~ - LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM IR VF at IF = 7.5 A TJ max. Package 15 A 600 V, 800 V, 1000 V 200 A 5 μA 0.87 V 150 °C BU Circuit configurations In-line FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU15065S) Available • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance please see www.vishay.
BU1508 Datasheet
