BU1508-M3
Key Features
- UL recognition file number E309391 (QQQX2) UL 1557 (see *)
- Thin single in-line package
- Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU15065S)
- Superior thermal conductivity
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: For definitions of compliance please see +~~ -
- Tested to UL standard for safety electrically isolated semiconductor devices. UL 1557 4th edition. Dielectric tested to maximum case, storage and junction temperature to 150 °C to withstand 1500 V. Epoxy meets UL 94 V-0 flammability rating.
