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BU1508 - Bridge Rectifiers

Download the BU1508 datasheet PDF. This datasheet also covers the BU1506 variant, as both devices belong to the same bridge rectifiers family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • UL recognition file number E312394.
  • Thin single in-line package.
  • Glass passivated chip junction.
  • Available for BU-5S lead forming option (part number with “5S” suffix, e. g. BU15065S) Available.
  • Superior thermal conductivity.
  • Solder dip 275 °C max. 10 s, per JESD 22-B106.
  • Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (BU1506_VishaySiliconix.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number BU1508
Manufacturer Vishay
File Size 145.47 KB
Description Bridge Rectifiers
Datasheet download datasheet BU1508 Datasheet

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Other Datasheets by Vishay

Part Number Description
BU1506 Bridge Rectifiers
BU1510 Bridge Rectifiers
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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.vishay.com BU1506, BU1508, BU1510 Vishay General Semiconductor Enhanced isoCink+™ Bridge Rectifiers + ~~ isoCink+™ Case Style BU - ~~+ +~~ - LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM IR VF at IF = 7.5 A TJ max. Package 15 A 600 V, 800 V, 1000 V 200 A 5 μA 0.87 V 150 °C BU Circuit configurations In-line FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU15065S) Available • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance please see www.vishay.