BU1508 Description
BU1506, BU1508, BU1510 Vishay General Semiconductor Enhanced isoCink+™ Bridge Rectifiers + ~~ isoCink+™ Case Style BU - ~~+ +~~ - LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM IR VF at IF = 7.5 A TJ max. Package 15 A 600 V, 800 V, 1000 V 200 A 5 μA 0.87 V 150 °C BU Circuit configurations In-line.
BU1508 Key Features
- UL recognition file number E312394
- Thin single in-line package
- Glass passivated chip junction
- Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU15065S)
- Superior thermal conductivity
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: for definitions of pliance please see .vishay./doc?99912