Datasheet4U Logo Datasheet4U.com

BU1506 - Bridge Rectifiers

Datasheet Summary

Features

  • UL recognition file number E312394.
  • Thin single in-line package.
  • Glass passivated chip junction.
  • Available for BU-5S lead forming option (part number with “5S” suffix, e. g. BU15065S) Available.
  • Superior thermal conductivity.
  • Solder dip 275 °C max. 10 s, per JESD 22-B106.
  • Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.

📥 Download Datasheet

Datasheet preview – BU1506

Datasheet Details

Part number BU1506
Manufacturer Vishay Siliconix
File Size 145.47 KB
Description Bridge Rectifiers
Datasheet download datasheet BU1506 Datasheet
Additional preview pages of the BU1506 datasheet.

📁 Similar Datasheet

  • BU1506 - Silicon Diffused Power Transistor (NXP)
  • BU1506-E3 - Bridge Rectifiers (Vishay)
  • BU1506-M3 - Bridge Rectifiers (Vishay)
  • BU1506DF - NPN Transistor (INCHANGE)
  • BU1506DX - Silicon Diffused Power Transistor (NXP)
  • BU1506DX - SILICON POWER TRANSISTOR (SavantIC)
  • BU1506DX - NPN Transistor (INCHANGE)
  • BU1507 - Silicon Diffused Power Transistor (NXP)
  • BU1507 - Silicon Diffused Power Transistor (NXP)
  • BU1507AX - Silicon Diffused Power Transistor (NXP)
Other Datasheets by Vishay Siliconix
  • BU1508 - Bridge Rectifiers
  • BU1510 - Bridge Rectifiers
  • BU1006 - Enhanced PowerBridge Rectifiers
  • BU1006A - Enhanced PowerBridge Rectifiers
  • BU1008 - Enhanced PowerBridge Rectifiers
  • BU1008A - Enhanced PowerBridge Rectifiers
  • BU1010 - Enhanced PowerBridge Rectifiers
  • BU1010A - Enhanced PowerBridge Rectifiers

Full PDF Text Transcription

Click to expand full text
www.vishay.com BU1506, BU1508, BU1510 Vishay General Semiconductor Enhanced isoCink+™ Bridge Rectifiers + ~~ isoCink+™ Case Style BU - ~~+ +~~ - LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM IR VF at IF = 7.5 A TJ max. Package 15 A 600 V, 800 V, 1000 V 200 A 5 μA 0.87 V 150 °C BU Circuit configurations In-line FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU15065S) Available • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance please see www.vishay.
Published: |