UHB20FCT Key Features
- Oxide planar chip junction
- Ultrafast recovery times
- Soft recovery characteristics
- Low switching losses, high efficiency
- High forward surge capability
- Meets MSL level 1, per J-STD-020C, LF max peak of 245 °C (for TO-263AB package)
- Solder Dip 260 °C, 40 seconds (for TO-220AB package)
- ponent in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC