UHB10FT
Key Features
- Oxide planar chip junction TO-220AC TO-263AB K
- Ultrafast recovery times
- Soft recovery characteristics
- Low switching losses, high efficiency A
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) 2 UH10FT PIN 1 PIN 2 CASE NC UHB10FT NC A K HEATSINK 1
- Solder dip 260 °C, 40 s (for TO-220AC package)
