* High thermal cycling performance
* Soft recovery characteristic
* Low on-state losses
* Surface-mountable package
* Low thermal resistance
* Enh.
* Dual Mode (DCM and CCM) PFC
* Power Factor Correction (PFC) for Interleaved Topology
4. Quick reference data
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Enhanced ultrafast power diode in a TO252 (DPAK) plastic package.
2. Features and benefits
* High thermal cycling performance
* Soft recovery characteristic
* Low on-state losses
* Surface-mountable package
* Low thermal resistanc.
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