W25M121AV memory equivalent, serial mcp flash memory.
.... 3 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 4
3.1 Pad Configuration WSON 8x6-mm ...... 4 3.2 Pad Description WSON 8x6-mm 4 4. DEVICE CONFIGURATION & PIN DESCRIPTI.
that demand high Program/Erase data throughput.
The SpiStack® product series introduces a new “Software Die Select (C2h).
......... 2 2. FEATURES..... 3 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 4
3.1 Pad Configuration WSON 8x6-mm ...... 4 3.2 Pad Description WSON 8x6-mm 4 4. DEVICE CONFIGURATION & PIN DESCRIPTIONS. 5 4.1 Serial MCP (SpiStack®) Device Configuration ..
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