W25Q64JV
Table of Contents
1. GENERAL DESCRIPTIONS..................................................................................................................4
2. FEATURES............................................................................................................................................4
3. PACKAGE TYPES AND PIN CONFIGURATIONS ...............................................................................5
3.1 Pin Configuration SOIC 208-mil ................................................................................................5
3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm ..................................................5
3.3 Pin Description SOIC 208-mil, WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm...............................5
3.4 Pin Configuration SOIC 300-mil ................................................................................................6
3.5 Pin Description SOIC 300-mil....................................................................................................6
3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ......................................................7
3.7 Ball Description TFBGA 5x5 or 8x6-mm ...................................................................................7
3.8 Ball Configuration WLCSP ........................................................................................................8
3.9 Ball Description WLCSP12........................................................................................................8
4. PIN DESCRIPTIONS .............................................................................................................................9
4.1 Chip Select (/CS).......................................................................................................................9
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .........................................9
4.3 Write Protect (/WP)....................................................................................................................9
4.4 HOLD (/HOLD) ..........................................................................................................................9
4.5 Serial Clock (CLK) .....................................................................................................................9
4.6 Reset (/RESET)(1) ......................................................................................................................9
5. BLOCK DIAGRAM ...............................................................................................................................10
6. FUNCTIONAL DESCRIPTIONS..........................................................................................................11
6.1 Standard SPI Instructions........................................................................................................11
6.2 Dual SPI Instructions ...............................................................................................................11
6.3 Quad SPI Instructions..............................................................................................................11
6.4 Software Reset & Hardware /RESET pin ................................................................................11
6.5 Write Protection .......................................................................................................................12
Write Protect Features ...............................................................................................................12
7. STATUS AND CONFIGURATION REGISTERS .................................................................................13
7.1 Status Registers ......................................................................................................................13
Erase/Write In Progress (BUSY) – Status Only ......................................................................13
Write Enable Latch (WEL) – Status Only................................................................................13
Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable......................................13
Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable.............................................14
Sector/Block Protect Bit (SEC) – Volatile/Non-Volatile Writable .............................................14
Complement Protect (CMP) – Volatile/Non-Volatile Writable .................................................14
Status Register Protect (SRP, SRL) – Volatile/Non-Volatile Writable .....................................15
Erase/Program Suspend Status (SUS) – Status Only ............................................................16
Security Register Lock Bits (LB3, LB2, LB1) – Volatile/Non-Volatile OTP Writable................16
Quad Enable (QE) – Volatile/Non-Volatile Writable ................................................................16
Write Protect Selection (WPS) – Volatile/Non-Volatile Writable .............................................17
Output Driver Strength (DRV1, DRV0) – Volatile/Non-Volatile Writable .................................17
Publication Release Date: March 27, 2018
-1-
Revision J
