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CAB760M12HM3
1200 V, 760 A, Silicon Carbide, Half-Bridge Module
VDS
1200 V
IDS
760 A
5
4
3
2
1
Technical Features
• Low Inductance, Low Profile 62 mm Footprint • High Junction Temperature (175 °C) Operation • Implements Switching Optimized Third Generation
SiC MOSFET Technology
• Light Weight AlSiC Baseplate • High Reliability Silicon Nitride Insulator
D
V+
G1 K1
Mid
NTC1
G2 K2
-t°
C
NTC2
V-
Typical Applications
• Railway & Traction • Solar • EV Chargers • Industrial Automation & Testing
System Benefits
1
• Lightweight, Compact Form Factor with 62 mm
Compatible Baseplate Enables System Retrofit
•
Increased System Efficiency, B
Conduction Losses of SiC
due
to
L45 ow
Switching
&
2
• High Reliability Material Selection
8
6 7
-t°
9 3
Key Parameters
Param