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XCCACEM64 Datasheet (XCCACEM16 - XCCACEM64) System ACE MPM Solution

Manufacturer: Xilinx (now AMD)

Download the XCCACEM64 datasheet PDF. This datasheet also includes the XCCACEM16 variant, as both parts are published together in a single manufacturer document.

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Note: The manufacturer provides a single datasheet file (XCCACEM16_XILINX.pdf) that lists specifications for multiple related part numbers.

General Description

The System ACE Multi-Package Module (MPM) solution addresses the need for a space-efficient, pre-engineered, high-density configuration solution in multiple FPGA systems.

The System ACE technology is a ground-breaking in-system programmable configuration solution that provides substantial savings in development effort and cost per bit over traditional PROM and embedded solutions for high capacity FPGA systems.

As shown in Figure 1, the System ACE MPM solution is a multi-package module that includes the System ACE MPM controller, a configu

Overview

www.DataSheet4U.com 0 R System ACE™ MPM Solution 0 0 DS087 (v1.2) June 7, 2002 Advance Product Specification Summary • System level, high capacity, pre-configured solution for Virtex™ Series FPGAs, Virtex-II Series Platform FPGAs, and Spartan™ FPGAs Industry standard Flash memory die combined with Xilinx controller technology in a single package Effortless density migration: - XCCACEM16-BG388I (16 Megabit (Mb)) - XCCACEM32-BG388I (32 Mb) - XCCACEM64-BG388I (64 Mb) All densities are available in the 388-pin Ball Grid Array package VCC I/O: 1.8V, 2.5V, and 3.

Key Features

  • tMAP bus and is connected to D1 on all target FPGAs. For Slave-Serial configuration mode, CFG_DATA[2] is the serial data signal for Serial-Slave Chai.