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ZL50110 - (ZL50110 / ZL50114) CESoP Processors

Description

The ZL50110/11/14 family of CESoP processors are highly functional TDM to Packet bridging devices.

Features

  • General.
  • Circuit Emulation Services over Packet (CESoP) transport for MPLS, IP and Ethernet networks On chip timing & synchronization recovery across a packet network Grooming capability for Nx64 Kbps trunking.
  • ZL50110GAG ZL50111GAG ZL50114GAG October 2005 Ordering Information 552 PBGA 552 PBGA 552 PBGA Trays, Bake & Drypack Trays, Bake & Drypack Trays, Bake & Drypack -40°C to +85°C Direct connection to LIUs, framers, backplanes Dual reference St.

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Datasheet Details

Part number ZL50110
Manufacturer Zarlink Semiconductor
File Size 1.09 MB
Description (ZL50110 / ZL50114) CESoP Processors
Datasheet download datasheet ZL50110 Datasheet

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Other Datasheets by Zarlink Semiconductor

Part Number Description
ZL50111 (ZL50110 / ZL50114) CESoP Processors
ZL50114 (ZL50110 / ZL50114) CESoP Processors
ZL50115 (ZL50115 - ZL50115) CESoP Processors
ZL50116 (ZL50115 - ZL50115) CESoP Processors
ZL50117 (ZL50115 - ZL50115) CESoP Processors

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.DataSheet4U.com ZL50110/11/14 128, 256 and 1024 Channel CESoP Processors Data Sheet Features General • • • Circuit Emulation Services over Packet (CESoP) transport for MPLS, IP and Ethernet networks On chip timing & synchronization recovery across a packet network Grooming capability for Nx64 Kbps trunking • • ZL50110GAG ZL50111GAG ZL50114GAG October 2005 Ordering Information 552 PBGA 552 PBGA 552 PBGA Trays, Bake & Drypack Trays, Bake & Drypack Trays, Bake & Drypack -40°C to +85°C Direct connection to LIUs, framers, backplanes Dual reference Stratum 3, 4 and 4E DPLL for synchronous operation Circuit Emulation Services • • • • • Complies with ITU-T recommendation Y.
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