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Package information - MSOP8
Surface mounted, 8 pin package Package outline
ec
E E1
D A2 A
R1
L R
b A1
DIM Millimeters
Inches
Min.
Max.
Min.
Max.
A - 1.10 - 0.0433
A1
0.05
0.15
0.002
0.006
A2
0.75
0.95
0.0295
0.0374
b
0.25
0.40
0.010
0.0157
c
0.13
0.23
0.005
0.009
D
2.90
3.10
0.114
0.122
E 4.90 BSC
0.193 BSC
E1
2.90
3.10
0.114
0.122
e 0.65 BSC
0.025 BSC
L
0.40
0.70
0.0157
0.0192
R 0.07 - 0.0027 -
R1 0.07
- 0.0027 -
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Soldering footprint
1.02 0.040
4.8 0.189
0.41 0.016
mm inches
0.65 0.023
Issue 2 - March 2007
© Zetex Semiconductors plc 2007
1
www.zetex.com
Package information - MSOP8
Nominal weight
Nominal weight per device 24.6mg.
MSOP8 Datasheet
