Overview: SN54ABT374, SN74ABT374A
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
SCBS111G – FEBRUARY 1991 – REVISED JANUARY 1997 D State-of-the-Art EPIC-ΙΙB™ BiCMOS Design
Significantly Reduces Power Dissipation
D Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
D Typical VOLP (Output Ground Bounce) < 1 V
at VCC = 5 V, TA = 25°C
D High-Drive Outputs (–32-mA IOH, 64-mA IOL) D ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Plastic (N) and Ceramic (J) DIPs, and
Ceramic Flat (W) Package SN54ABT374 . . . J OR W PACKAGE SN74ABT374A . . . DB, DW, N, OR PW PACKAGE
(TOP VIEW) OE 1 1Q 2 1D 3 2D 4 2Q 5 3Q 6 3D 7 4D 8 4Q 9 GND 10 20 VCC 19 8Q 18 8D 17 7D 16 7Q 15 6Q 14 6D 13 5D 12 5Q 11 CLK SN54ABT374 . . .
