2.7 V TO 5.5 V 12ĆBIT PARALLEL DIGITALĆTOĆANALOG CONVERTER
WITH POWER DOWN
SGLS124A − JULY 2002 − REVISED DECEMBER 2003
D Controlled Baseline
− One Assembly/Test Site, One Fabrication
D Extended Temperature Performance of
−40°C to 125°C
D Enhanced Diminishing Manufacturing
Sources (DMS) Support
D Enhanced Product Change Notification
D Qualification Pedigree†
D Single Supply 2.7-V to 5.5-V Operation
D ±0.4 LSB Differential Nonlinearity (DNL),
±1.5 LSB Integral Nonlinearity (INL)
D 12-Bit Parallel Interface
D Compatible With TMS320 DSP
D Internal Power On Reset
D Settling Time 1 µs Typ
D Low Power Consumption:
− 8 mW for 5-V Supply
− 4.3 mW for 3-V Supply
D Reference Input Buffers
D Voltage Output
D Monotonic Over Temperature
D Asynchronous Update
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
D Battery Powered Test Instruments
D Digital Offset and Gain Adjustment
D Battery Operated/Remote Industrial
D Machine and Motion Control Devices
D Cordless and Wireless Telephones
D Speech Synthesis
D Communication Modulators
D Arbitrary Waveform Generation
The TLV5619 is a 12-bit voltage output DAC with a microprocessor and TMS320 compatible parallel interface.
The 12 data bits are double buffered so that the output can be updated asynchronously using the LDAC pin.
During normal operation, the device dissipates 8 mW at a 5-V supply and 4.3 mW at a 3-V supply. The power
consumption can be lowered to 50 nW by setting the DAC to power-down mode.
The output voltage is buffered by a ×2 gain rail-to-rail amplifier, which features a Class A output stage to improve
stability and reduce settling time.
−40°C to 125°C SOP − DW
Tape and reel TLV5619QDWREP TLV5619QEP
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 2002 − 2003, Texas Instruments Incorporated
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