ATS-50250P-C2-R0 - Ultra High Performance BGA Cooling
ATS-50250P-C2-R0 Features
* & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Meets Telcordia GR-63-Core Office Vibration; ETSI 3
