HC1000 Datasheet, Material, Bergquist

HC1000 Features

  • Material
  • Thermal conductivity: 1.0 W/m-K
  • Highly conformable, low hardness
  • “Gel-like” modulus
  • Fiberglass reinforced for puncture, shear and tear resistance

PDF File Details

Part number:

HC1000

Manufacturer:

Bergquist

File Size:

52.46kb

Download:

📄 Datasheet

Description:

Gel-like modulus gap filling material.

Datasheet Preview: HC1000 📥 Download PDF (52.46kb)

HC1000 Application

  • Applications Include:
  • Computer and peripherals
  • Telecommunications
  • Heat interfaces to frames, chassis, or other heat sp

TAGS

HC1000
Gel-Like
Modulus
Gap
Filling
Material
Bergquist

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Stock and price

part
Abracon Corporation
MEMS OSC XO 100.0000MHZ HCSL SMD
DigiKey
ASFLMPHC-100.000MHZ-LR-T
5000 In Stock
Qty : 2000 units
Unit Price : $4.18
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