Datasheet4U Logo Datasheet4U.com

HC1000

Gel-Like Modulus Gap Filling Material

HC1000 Features

* Thermal conductivity: 1.0 W/m-K

* Highly conformable, low hardness

* “Gel-like” modulus

* Fiberglass reinforced for puncture, shear and tear resistance Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical

HC1000 Datasheet (52.46 KB)

Preview of HC1000 PDF

Datasheet Details

Part number:

HC1000

Manufacturer:

Bergquist

File Size:

52.46 KB

Description:

Gel-like modulus gap filling material.

📁 Related Datasheet

HC1000 High End Humidity Sensors (Handling Instructions)

HC10 TRIPLE 3-INPUT POSITIVE-NAND GATES (Texas Instruments)

HC101 High End Humidity Sensors (Handling Instructions)

HC106B 2A SCRs (HAOHAI)

HC106BF 2A SCRs (HAOHAI)

HC106BS 2A SCRs (HAOHAI)

HC106D Sensitive Gate Silicon Controlled Rectifier (Huashan)

HC106D 2A SCRs (HAOHAI)

HC106DF 2A SCRs (HAOHAI)

HC106DS 2A SCRs (HAOHAI)

TAGS

HC1000 Gel-Like Modulus Gap Filling Material Bergquist

HC1000 Distributor