HC1000 Datasheet - Bergquist

HC1000, Gel-Like Modulus Gap Filling Material

Gap Pad® HC1000 “Gel-Like” Modulus Gap Filling Material Resultant Thickness (mils) Section A Section B Section C Section D Section E .

Features

* Thermal conductivity: 1.0 W/m-K
* Highly conformable, low hardness
* “Gel-like” modulus
* Fiberglass reinforced for puncture, shear and tear resistance Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical

Applications

* Include:
* Computer and peripherals
* Telecommunications
* Heat interfaces to frames, chassis, or other heat spreading devices
* RDRAM™ memory modules / chip scale packages
* CDROM / DVD cooling
* Areas where irregular surfaces need to make a thermal i

HC1000-Bergquist.pdf

HC1000 Datasheet Preview — Preview of HC1000 PDF

Datasheet Details

Part number:

HC1000

Manufacturer:

Bergquist

File Size:

52.46 KB

Description:

Gel-Like Modulus Gap Filling Material

HC1000 Distributors

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HC1000 Gel-Like Modulus Gap Filling Material Bergquist

Bergquist HC1000-like datasheet