Datasheet Details
- Part number
- HC1000
- Manufacturer
- Bergquist
- File Size
- 52.46 KB
- Datasheet
- HC1000-Bergquist.pdf
- Description
- Gel-Like Modulus Gap Filling Material
HC1000 Description
Gap Pad® HC1000 “Gel-Like” Modulus Gap Filling Material Resultant Thickness (mils) Section A Section B Section C Section D Section E .
HC1000 Features
* Thermal conductivity: 1.0 W/m-K
* Highly conformable, low hardness
* “Gel-like” modulus
* Fiberglass reinforced for puncture,
shear and tear resistance
Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical
HC1000 Applications
* Include:
* Computer and peripherals
* Telecommunications
* Heat interfaces to frames, chassis, or other heat spreading devices
* RDRAM™ memory modules / chip scale packages
* CDROM / DVD cooling
* Areas where irregular surfaces need to make a thermal i
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