Part number:
HC1000
Manufacturer:
Bergquist
File Size:
52.46 KB
Description:
Gel-like modulus gap filling material.
* Thermal conductivity: 1.0 W/m-K
* Highly conformable, low hardness
* “Gel-like” modulus
* Fiberglass reinforced for puncture, shear and tear resistance Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical
HC1000
Bergquist
52.46 KB
Gel-like modulus gap filling material.
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