SOT23-5 Datasheet (Bourns)

SOT23-5, surface mount

PACKAGE MECHANICAL INFORMATION SOT23-5 Package Outline Dimensions This surface mount package consists of a chip mounted on a leadframe and fully encapsulated in an epoxy mold compound.

With Pb-Free terminations, this package meets the requirements of IPC/Jedec J-STD-20, moisture level 1 at 260 °C.

5-Pin Plastic Small Outline Surface Mount MO-178, AA, JEDEC 95 1.90 TYP.

(0.075) 2.60 - 3.00 (0.102 - 0.118) 5 4 1 2 3 1.14 - 1.35 (0.045 - 0.053) 0.95 TYP.

(0.037) 2.80 - 3.00 (0.110 - 0.