HSMF-C116 Datasheet, Chipled, Broadcom

HSMF-C116 Features

• Chipled
• LED with AlInGaP and InGaN die
• Surface mount device with ultra small 1.0 × 1.0mm footprint
• Suitable for application that requires small pitch size

PDF File Details

Part number:

HSMF-C116

Manufacturer:

Broadcom

File Size:

590.37kb

Download:

📄 Datasheet

Description:

Ultra small surface mount tricolor chipled. This ultra-small tricolor chipLED is designed for close pitch assembly and also for portable and wearables applications. The package

HSMF-C116 Application

• Applications The package uses high intensity red AlInGaP die and high intensity InGaN green and blue die. To improve contrast the PCB substrate has

TAGS

HSMF-C116

Broadcom

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