HSMF-C116 Datasheet - Broadcom

HSMF-C116 Ultra Small Surface Mount Tricolor ChipLED

This ultra-small tricolor chipLED is designed for close pitch assembly and also for portable and wearables applications. The package uses high intensity red AlInGaP die and high intensity InGaN green and blue die. To improve contrast the PCB substrate has a black surface. Applications * Display .

HSMF-C116 Features

* LED with AlInGaP and InGaN die

* Surface mount device with ultra small 1.0 × 1.0mm footprint

* Suitable for application that requires small pitch size

* Compatible with reflow soldering

* Taped in 8mm carrier tape on a 7 inch diameter reel Package Dimensions Pin4 1.05 Pin1 0

HSMF-C116-Broadcom.pdf