CP221 Datasheet - Central Semiconductor

CP221 Small Signal Transistor

( DataSheet : www.DataSheet4U.com ) PROCESS Small Signal Transistor CP221 Central TM NPN- High Voltage Darlington Transistor Chip Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 7,290 PRINCIPAL DEVICE TYPES CZT2000 EPITAXIAL BASE 39.5 X 39.5 MILS 9.8 MILS 3.9 x 5.1 MILS 7.9 x 3.9 MILS Al - 24,000Å Au - 12,000Å 145 Adams Avenue Hauppauge, NY 1.

CP221 Datasheet (273.57 KB)