CP211 Datasheet (Central Semiconductor) - Power Transistor NPN

CP211, Power Transistor NPN - Amp/Switch Transistor Chip

www.DataSheet4U.com PROCESS Power Transistor CP211 Central TM NPN - Amp/Switch Transistor Chip Semiconductor Corp.

PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 1,450 PRINCIPAL DEVICE TYPES 2N3054A DataSheet4U.com CJD41C TIP41C EPITAXIAL BASE 80 x 99 MILS 12.5 MILS 12 x 32 MILS 13 x 48 MILS Al - 30,000Å Cr/Ni/Ag 16,000Å e DataShe BACKSIDE COLLECTOR 145 Adams