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PROCESS CP283
Power Transistor
NPN - Silicon Power Transistor Chip
CentralTM
Semiconductor Corp.
PROCESS DETAILS Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization
68 x 68 MILS 9.5 MILS 18 x 11 MILS 18 x 12 MILS Al - 45,000Å Ti/Ni/Ag - (3000Å, 10,000Å, 10,000Å)
GEOMETRY
GROSS DIE PER 5 INCH WAFER 3,675
PRINCIPAL DEVICE TYPES MJE13003
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