CP324 Datasheet (Central Semiconductor) - Small Signal MOSFET Transistor N- Channel Enhancement-Mode Transistor Chip

CP324, Small Signal MOSFET Transistor N- Channel Enhancement-Mode Transistor Chip

PROCESS Small Signal MOSFET Transistor N- Channel Enhancement-Mode Transistor Chip CP324 PROCESS DETAILS Process Die Size Die Thickness Gate Bonding Pad Area Source Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 33,500 PRINCIPAL DEVICE TYPES 2N7002 EPITAXIAL PLANAR 21.65 x 21.65 MILS 9.0 MILS 5.5 x 5.5 MILS 5.9 x 13.8 MILS Al - 30,000Å Au - 12,000Å BACKSIDE DRAIN R3 (22-March 2010) w w w.

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