Datasheet4U Logo Datasheet4U.com

CP305 Datasheet - Central Semiconductor

CP305 Small Signal Transistor NPN - High Current Transistor Chip

PROCESS Small Signal Transistor CP305 NPN - High Current Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 11,212 PRINCIPAL DEVICE TYPES 2N3019 CMPT3019 CXT3019 CZT3019 EPITAXIAL PLANAR 31 x 31 MILS 9.0 MILS 5.9 x 11.8 MILS 6.5 x 13.8 MILS Al - 30,000Å Au - 18,000Å R3 (22-March 2010) w w w. c e n t r a l s e m i . c o m www.DataSheet4U.com PROCESS C.

CP305 Datasheet (490.64 KB)

Preview of CP305 PDF

Datasheet Details

Part number:

CP305

Manufacturer:

Central Semiconductor ↗

File Size:

490.64 KB

Description:

Small signal transistor npn - high current transistor chip.

📁 Related Datasheet

CP300 SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A/ HEAT-SINK MTG 3A(VOLTAGE - 50 to 1000 Volts CURRENT - 3.0 Amperes) (Pan Jit International Inc.)

CP300 SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A/ HEAT-SINK MTG 3A (TRSYS)

CP301 SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A/ HEAT-SINK MTG 3A(VOLTAGE - 50 to 1000 Volts CURRENT - 3.0 Amperes) (Pan Jit International Inc.)

CP301 SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A/ HEAT-SINK MTG 3A (TRSYS)

CP3010 SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A/ HEAT-SINK MTG 3A(VOLTAGE - 50 to 1000 Volts CURRENT - 3.0 Amperes) (Pan Jit International Inc.)

CP3010 SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A/ HEAT-SINK MTG 3A (TRSYS)

CP302 SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A/ HEAT-SINK MTG 3A(VOLTAGE - 50 to 1000 Volts CURRENT - 3.0 Amperes) (Pan Jit International Inc.)

CP302 SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A/ HEAT-SINK MTG 3A (TRSYS)

CP302-MPSH10 NPN - RF Transistor Die (Central Semiconductor)

CP3020-7R 120...195 Watt DC-DC Converters (Power-One)

TAGS

CP305 Small Signal Transistor NPN High Current Transistor Chip Central Semiconductor

Image Gallery

CP305 Datasheet Preview Page 2

CP305 Distributor