-Axial lead type devices for through hole design. -Low power loss, high efficiency. -High current capability, Low forward voltage drop. -High surge capability. -Ultra high-speed switching. -Silicon epitaxial planar chip, metal silicon junction. -Lead-free part meets environmental standards of MIL-STD-19500/228
1.0(25.4) min. DO-27
0.052(1.30) 0.048(1.20)
DIA. 0.375(9.50) 0.285(7.20)
0.220(5.60) 0.197(5.00)
DIA. Mechanical Data
-Case: Molded plastic, DO-201AD/DO-27 -Epoxy: UL94V-0 rate fla.
