RGP208 Features
* MECHANICAL SPECIFICATION PROPRIETARY SOFT GLASS R JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE ACTUAL SIZE OF DO-41 PACKAGE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) SERIES RGP200 - R
Datasheet Details
RGP208, RGP200
DIOTEC
410.41 KB
2 amp fast recovery silicon diodes.
This datasheet PDF includes multiple part numbers: RGP208, RGP200. Please refer to the document for exact specifications by model.
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RGP208 Distributor
