* MECHANICAL SPECIFICATION PROPRIETARY SOFT GLASS R JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE ACTUAL SIZE OF DO-41 PACKAGE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) SERIES RGP200 - R
RGP208
DIOTEC
410.41 KB
2 amp fast recovery silicon diodes.
DIOTEC ELECTRONICS CORP.
18020 Hobart Blvd., Unit B Gardena, CA 90248 U.S.A Tel.: (310) 767-1052 Fax: (310) 767-7958
Data Sheet No. FSPD-200-1B
2 AM.
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