SBU6G - (SBU6x) General Purpose Diodes
SBU6G Features
* MECHANICAL SPECIFICATION SBU PACKAGE SHOWN ACTUAL SIZE C C1 C2 D D3 _ D2 + D D1 A VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE
