SBU6G Features
* MECHANICAL SPECIFICATION SBU PACKAGE SHOWN ACTUAL SIZE C C1 C2 D D3 _ D2 + D D1 A VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE
SBU6A_DiotecElectronicsCorporation.pdf
Datasheet Details
SBU6G, SBU6A
Diotec Electronics Corporation
91.64 KB
(sbu6x) general purpose diodes.
This datasheet PDF includes multiple part numbers: SBU6G, SBU6A.
Please refer to the document for exact specifications by model.
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SBU6G Distributor
