DT8C01 - (DT8C00 - DT8C10) 8 AMP SILICON BRIDGE RECTIFIERS
DT8C01 Features
* MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE d H b F8G CED 687 9ยก@ SYM A B B1 B2 B3 C C1 C2 D D1 D2 D3 D4 M
