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GP1600FSM18 - Hi-Reliability Single Switch IGBT Module

Datasheet Summary

Features

  • s s s s High Thermal Cycling Capability 1600A Per Module Non Punch Through Silicon Isolated MMC Base with AlN Substrates KEY.

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Datasheet Details

Part number GP1600FSM18
Manufacturer Dynex Semiconductor
File Size 127.23 KB
Description Hi-Reliability Single Switch IGBT Module
Datasheet download datasheet GP1600FSM18 Datasheet
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Full PDF Text Transcription

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GP1600FSM18 GP1600FSM18 Hi-Reliability Single Switch IGBT Module Replaces May 2000 version, DS5361-1.1 DS5361-2.3 January 2001 FEATURES s s s s High Thermal Cycling Capability 1600A Per Module Non Punch Through Silicon Isolated MMC Base with AlN Substrates KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1800V 3.5V 1600A 3200A APPLICATIONS External connection s s s s High Reliability Inverters Motor Controllers Traction Drives Resonant Converters G Aux C C1 C2 The Powerline range of high power modules includes dual and single switch configurations covering voltages from 1200V to 3300V and currents up to 4800A. The GP1600FSM18 is a single switch 1800V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module.
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