Description
Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ371PZ minimizes both PCB space and rDS(on).
Battery management
Load switch
Battery protection
Pin 1 S D G
Features
- Max rDS(on) = 75 mΩ at VGS = -4.5 V, ID = -2.0 A.
- Max rDS(on) = 90 mΩ at VGS = -2.5 V, ID = -1.5 A.
- Max rDS(on) = 110 mΩ at VGS = -1.8 V, ID = -1.0 A.
- Max rDS(on) = 150 mΩ at VGS = -1.5 V, ID = -1.0 A.
- Occupies only 1.0 mm2 of PCB area. Less than 30% of the area of 2 x 2 BGA.
- Ultra-thin package: less than 0.4 mm height when mounted to PCB.
- HBM ESD protection level >4.4kV typical (Note 3).
- RoHS Compliant
®
tm
General Descr.
FDZ371PZ_FairchildSemiconductor.pdf
