FDZ371PZ Datasheet - Fairchild Semiconductor

FDZ371PZ Thin WL-CSP MOSFET

Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ371PZ minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent the.

FDZ371PZ Features

* Max rDS(on) = 75 mΩ at VGS = -4.5 V, ID = -2.0 A

* Max rDS(on) = 90 mΩ at VGS = -2.5 V, ID = -1.5 A

* Max rDS(on) = 110 mΩ at VGS = -1.8 V, ID = -1.0 A

* Max rDS(on) = 150 mΩ at VGS = -1.5 V, ID = -1.0 A

* Occupies only 1.0 mm2 of PCB area.Less than 30% of t

FDZ371PZ_FairchildSemiconductor.pdf