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RMPA2266

WCDMA Band I Power Amplifier Module

RMPA2266 Features

* 40% WCDMA efficiency at +28dBm Pout

* 20% WCDMA efficiency (58mA total current) at

* tm General Description

* The RMPA2266 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA +

RMPA2266 General Description


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* The RMPA2266 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA +16dBm Pout applications. Answering the call for ultra-low DC power Low quiescent current (Iccq): 25mA in low-power consumption and extended .

RMPA2266 Datasheet (222.07 KB)

Preview of RMPA2266 PDF

Datasheet Details

Part number:

RMPA2266

Manufacturer:

Fairchild Semiconductor

File Size:

222.07 KB

Description:

Wcdma band i power amplifier module.

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RMPA2266 WCDMA Band Power Amplifier Module Fairchild Semiconductor

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