Part number:
FP100
Manufacturer:
Filtronic Compound Semiconductors
File Size:
32.67 KB
Description:
High performance phemt.
* 14 dBm P-1dB at 12 GHz
* 9 dB Power Gain at 12 GHz
* 3.0 dB Noise Figure at 12 GHz
* DESCRIPTION AND APPLICATIONS DIE SIZE: 16.5 x 16.5 mils (420 x 420 µm) DIE THICKNESS: 3.9 mils (100 µm typ.) BONDING PADS: 3.3 x 3.5 mils (85 x 90 µm typ.) The FP100 is an Alumi
FP100
Filtronic Compound Semiconductors
32.67 KB
High performance phemt.
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