FP100 Datasheet, phemt equivalent, Filtronic Compound Semiconductors

FP100 Features

• Phemt
• 14 dBm P-1dB at 12 GHz
• 9 dB Power Gain at 12 GHz
• 3.0 dB Noise Figure at 12 GHz
• DESCRIPTION AND APPLICATIONS DIE SIZE: 16.5 x 16.5 mils (420 x

PDF File Details

Part number:

FP100

Manufacturer:

Filtronic Compound Semiconductors

File Size:

32.67kb

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📄 Datasheet

Description:

High performance phemt. AND APPLICATIONS DIE SIZE: 16.5 x 16.5 mils (420 x 420 µm) DIE THICKNESS: 3.9 mils (100 µm typ.) BONDING PADS: 3.3 x 3.5 mils (85 x

FP100 Application

• Applications DIE SIZE: 16.5 x 16.5 mils (420 x 420 µm) DIE THICKNESS: 3.9 mils (100 µm typ.) BONDING PADS: 3.3 x 3.5 mils (85 x 90 µm typ.) The FP

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FP100

Filtronic Compound Semiconductors

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