Datasheet4U Logo Datasheet4U.com

FP100 Datasheet - Filtronic Compound Semiconductors

FP100 - HIGH PERFORMANCE PHEMT

AND APPLICATIONS DIE SIZE: 16.5 x 16.5 mils (420 x 420 µm) DIE THICKNESS: 3.9 mils (100 µm typ.) BONDING PADS: 3.3 x 3.5 mils (85 x 90 µm typ.) The FP100 is an Aluminum Gallium Arsenide / Indium Gallium Arsenide (AlGaAs/InGaAs) Pseudomorphic High Electron Mobility Transistor (PHEMT), utilizing an .

FP100_FiltronicCompoundSemiconductors.pdf

Preview of FP100 PDF
FP100 Datasheet Preview Page 2

Datasheet Details

Part number:

FP100

Manufacturer:

Filtronic Compound Semiconductors

File Size:

32.67 KB

Description:

High performance phemt.

FP100 Distributor

📁 Related Datasheet

📌 All Tags